The Many Different Laser Cutters For Sale

With so many laser cutting machines for sale, it\'s hard to decide which one is best for your needs.Industrial laser cutting machine is a machine that uses laser to perform various cutting applications on metal parts.Although, there are many different changes in these machines, designed for different applications.The three main types of laser cutting machines include: CO2, Nd and Nd-yaluminum-garnet (Nd-YAG).CO2 lasers are designed for drilling, cutting and engraving functions.Thanks to its versatility, this is one of the most common laser cutting equipment used in today\'s production and manufacturing facilities.They are most commonly used for cutting carbon steel, titanium, stainless steel, aluminum, paper, wood, plastic, wax and fabric.Their role is primarily to deliver current through a mixture of carbon dioxide, helium and nitrogen, but can also be generated using the energy generated by RF.Since the RF method causes less electrode corrosion than other methods, it is becoming more and more popular.The Nd laser cutting machine is designed for boring functions that require high energy.Compared with other types of laser machinery, the repetition speed of this type of machine tool is also much lower.Nd-YAG is designed for higher power drilling, engraving and metal trimming applications.This type of cutter is very similar to the nd version.They are usually used for processing ceramics and various metals.Another laser cutting machine for sale is the laser micro-jet, which uses a combination of water jet and laser to cut the material.The water jet is used to guide the laser when cutting, but it also removes the debris and cools the workpiece during cutting.This material cutting tool has several advantages compared to other laser cutting machines, including increasing the cutting speed, cleaning the cutting and increasing the breaking strength of the cutting material.In addition to different types of machines, a variety of laser cutting processes are used in the industry.These processes include: Reaction and evaporation cutting, thermal stress cracking, melting cutting, and stealth cutting of silicon wafers.Reaction cutting basically uses laser cutting, similar to oxygen torch cutting.This process can cut thin and thick materials with very low energy.Evaporation cutting uses a focused energy beam to heat the surface of the workpiece to the melting point.Therefore, materials such as wood and carbon that cannot be melted usually use this cutting method.Surface cracks are formed using thermal stress cracking on brittle materials, which can be guided by laser.This method is commonly used in glass cutting.The melting cut will be blown away by a molten material heated to the melting point by a concentrated laser.The material is removed by high pressure airflow.This method is most commonly used in metals.Silicon wafer stealth paddle with NdA laser that separates the material chip from the silicon wafer.This process is only for silicon.Determining the right laser cutting machine and method depends to a large extent on the requirements of the material and the project.