The advantage of hybrid laser cleaning machine is that the continuous laser and pulsed laser are functionally composited at the same time to form a processing characteristic of 1+1>2. The principle is mainly through the semiconductor continuous laser as the heat conduction output, so that the attachment to be cleaned absorbs energy to generate vaporization and plasma cloud, and forms a thermal expansion pressure between the metal material and the attachment, reducing the bonding force between the two layers. When the pulsed laser outputs a high-energy pulsed laser beam, the generated vibration shock wave will cause the attachments with weak binding force to be directly separated from the metal surface, thereby realizing rapid laser cleaning.
