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UV Laser Marking Machine

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UV Laser Marking Machine
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Model:
QA-UVM3
MOQ:
1 set
Payment:
T/T, LC, Western Union
Delivery Time:
20 days
Warranty:
2 years
Service:
Online and overseas for whole life
Certification:
CE, ISO, FDA
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DESCRIPTION

 

With small UV focus spot and heat affected zone, UV laser marking machine has high absorptivity to 355nm UV-light, which is suitable for many materials. 

 

FEATURES

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PRODUCT PARAMETERS

Model

QA-UVM3

Laser Wavelength

355nm (Ultra-Violet)

Laser Type

Nd:YVO4

Laser Output Power

3W/5W/10W

Beam Diameter/Quality

TEM00(M2<50μrad1.3)

Pulse Width @30KHz

18ns 

Pulse energy @30KHZ

100uJ / 166uJ / 333uJ

Beam-pointing

<50μrad< p="">

Long-Term Stability

≤3%rms

Beam Divergence

≤2mrad

Polarization Ratio

>100:1

Power Consumption

500W

Pulse Repetition Rate

10kHz-500kHz

Beam Roundness

≥90%

Pulse-to Pulse Stability

≤3%rms

Beam Diameter

≤0.7mm

Operating Voltage

AC220 or AC110

Classification

Class 4

Laser Life Span

10,000hrs–15,000hrs

Max. Working Speed

7000mm/s (depending on material)

Working Area

70x70mm, 110x110mm, 200x200mm

Working temperature

-10-50℃

Repeatability

0.01mm

Positioning accuracy

0.01mm-0.2mm

Min Line Width

0.01mm

Cooling

Air/Air/Water

No. Axis

2 Axis (3 Axis Optional)

Rotation

Optional

Power supply

220V, 50/60Hz, 1KVA (110-120Vac Optional)

Controller

Computer with marking software

USB 2.0 Compatible

Yes

File Types

PLT, DXF, AI, DST, BMP, JPG, TIF

Max. Operating Time

24hrs (recommend a 1hr cool down period)

Dimensions

0.5m³

Weight (kg)

120kg

APPLICATIONS

UV Laser Marking Machine is mainly applied in ceramic cutting, scribing and marking, and material micromachining, laser rapid prototyping, FPCB cutting, millipore(d≤10μm) punching, flexible PCB marking and scribing, removal of metal and non-metal coating, processing of silicon wafers' millipores and dead holes, the marking content can be text, barcodes and graphics/pictures on most of the materials.

PRODUCT MESSAGE

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