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UV Laser Cutting and Marking for PCB 15W

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UV Laser Cutting and Marking for PCB 15W
UV laser cutting for cold processing for PCB and nonmetals
UV laser cutting for nonmetal materials
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Model:
QA-UV15C
MOQ:
1 set
Payment:
T/T, LC
Delivery Time:
10-45 Days
Warranty:
1 year
Service:
Online and overseas for wholelife
Certification:
CE ISO
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DESCRIPTION

Today's flexible boards are increasingly complex in shape and have shorter lead times. The traditional flexible plate processing technology uses the machining method to open the cover window and the processing shape, which can not meet the market requirements: First, because the mold opening cycle is longer; Second, because the molds required for the complex flexible plates are inevitably more complicated. For small and medium batches, the cost is considerable; thirdly, the particularly complicated opening is more difficult to process with the mold due to the shape and size factors.

FEATURES

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PRODUCT PARAMETERS

Laser Source

UV Laser

Laser Wavelength

355nm

Laser Power

15W

Position Accurate

±2μm

Repeat Accurate

±1μm

 Working area

450mmX250mmaccording request

CCD Position Accurate

±3μm

Single working area

40mmх40mm(Adjustable)

Repeat Accurate of Scanner

±1μm

Cutting Size Accurate

30μm

Cutting Position Accurate

50μm

Cutting Edge

20μmAccording material

File format of Cutting

Standard GerberDXFPLT

Widely used in the cutting of organic materials and inorganic materials, especially suitable for PCB cutting board, FPC cutting, film cutting window, wafer cutting / scribing, ceramic cutting / scribing / drilling, glass cutting / scribing / Filamentation, fingerprint identification chip cutting, PET film cutting, PI film cutting, copper foil and other ultra-thin metal cutting, drilling, composite cutting. 


APPLICATIONS

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Widely used in the cutting of organic materials and inorganic materials, especially suitable for PCB cutting board, FPC cutting, film cutting window, wafer cutting / scribing, ceramic cutting / scribing / drilling, glass cutting / scribing / Filamentation, fingerprint identification chip cutting, PET film cutting, PI film cutting, copper foil and other ultra-thin metal cutting, drilling, composite cutting. 

PRODUCT MESSAGE

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